您的位置: 专家智库 > >

微波毫米波单片集成电路与模块国家级重点实验室基金(9140C140401)

作品数:1 被引量:2H指数:1
相关作者:陈刚李哲洋任春江柏松更多>>
相关机构:南京电子器件研究所更多>>
发文基金:微波毫米波单片集成电路与模块国家级重点实验室基金更多>>
相关领域:电子电信更多>>

文献类型

  • 1篇中文期刊文章

领域

  • 1篇电子电信

主题

  • 1篇SCHOTT...
  • 1篇TI
  • 1篇4H-SIC
  • 1篇FACTOR
  • 1篇IMPLAN...
  • 1篇IDEAL

机构

  • 1篇南京电子器件...

作者

  • 1篇柏松
  • 1篇任春江
  • 1篇李哲洋
  • 1篇陈刚

传媒

  • 1篇Journa...

年份

  • 1篇2007
1 条 记 录,以下是 1-1
排序方式:
Ti/4H-SiC Schottky Barrier Diodes with Field Plate and B^+ Implantation Edge Termination Technology被引量:2
2007年
This paper describes the fabrication and electrical characteristics of Ti/4H-SiC Schottky barrier diodes (SBDs). The ideality factor n = 1.08 and effective Schottky barrier heightφ= 1.05eV of the SBDs were measured with the method of forward current density-voltage (J-V). A low reverse leakage current below 5.96 ×10^-3A/cm^2 at a bias voltage of - 1. 1kV was obtained. By using B^+ implantation,an amorphous layer as the edge termination was formed. We used the PECVD SiO2 as the field plate dielectric. The SBDs have an on-state current density of 430A/cm^2 at a forward voltage drop of about 4V. The specific on-resistance Ro, was found to be 6. 77mΩ2 · cm^2 .
陈刚李哲洋柏松任春江
关键词:4H-SICIMPLANTATION
共1页<1>
聚类工具0