Wettability of molten Sn-Ag-Cu alloy on Cu substrate has been determined by sessile drop method, as well as its dependence on time and temperature. It was found that the evolution of contact angle at the alloy’s melting point experienced four different stages. Especially, the contact angle was unstable and fluctuant in stage II, and gradually decreased in stage III mainly due to a chemical reaction between Sn-Ag-Cu alloy and Cu substrate. The contact angle decreased with increasing temperature, but increased slightly at 629 K, for another chemical reaction occurred. Interfacial characteristic has been further investigated by examining the sample’s cross section. Intermetallic compounds of Cu6Sn5 and β-Sn phase were found at the interface of Sn-Ag-Cu/Cu.
The surface tension of molten AlSi20 alloy has been measured by using the sessile drop method at 923―1123 K under argon atmosphere in both heating-up and cooling processes. The result shows that the surface tension of this alloy decreases as long as temperature increases. The results of surface tension and contact angles in heating-up process have differences from those obtained in cooling process, because the metal microstructures have some changes at different temperatures based on the metal genetic theory. The surface tension of molten AlSi20 alloy and that of molten pure aluminum have been compared as well, and the temperature coefficient of AlSi20 alloy is slightly lower than that of Al. The result has been analyzed by the linear scanning analysis with ESEM. The concentration of silicon in most region of the bulk is lower than that of the surface and the addition of Si to pure Al decreases the surface tension of molten pure Al.
The reactive wetting kinetics of a Sn-30Bi-0.5Cu Pb-free solder alloy on a Cu substrate was investigated by the sessile drop method from 493 to 623 K.The triple line frontier,characterized by the drop base radius R was recorded dynamically with a high resolution CCD using different spreading processes in an Ar-H 2 flow.We found a good agreement with the De Gennes model for the relationship between ln(dR/dt) and lnR for the spreading processes at 493 and 523 K.However,a significant deviation from the De Gennes model was found for the spreading processes at 548 and 623 K.Our experimental results show a complicated temperature effect on the spreading kinetics.Intermetallics at the Sn-30Bi-0.5Cu/Cu interface were identified as Cu 6 Sn 5 adjacent to the solder and Cu 3 Sn adjacent to the Cu substrate.The intermetallic compounds effectively enhanced the triple line mobility because of reaction product formation at the diffusion frontier.
